Packaged semiconductor module



FIG. 1 is a perspective view of a packaged semiconductor module showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a left side view thereof;

FIG. 8 is a cross sectional view taken along lines 8-8 in FIG. 2; and,

FIG. 9 is a cross sectional view taken along lines 9-9 in FIG. 2. 

CLAIM The ornamental design for a packaged semiconductor module, as shown and described. 